Weight: 500g/bottle
Ingredients: Tin 63% Lead 37%
Viscosity: 200±30 (adjustable)
Expansion rate: >90%
Shelf life: half a year
product type:
|
Lead-free solder paste |
Solder paste |
|
|
Low temperature solder paste |
Medium temperature solder paste |
High temperature solder paste |
|
Weakly active solder paste |
Medium active solder paste |
Strong active solder paste |
Product number:
|
alloy composition |
Melting point range (℃) |
use |
|
Leaded solder paste series |
||
|
Sn63-Pb37 |
183 |
Suitable for high-requirement circuit boards, such as: high-precision instruments, electronics industry, communications, micro technology, aviation industry and other products welding |
|
Sn62.6-Pb37-Ag0.4 |
183 |
|
|
Sn60-Pb40 |
183-190 |
|
|
Sn55-Pb45 |
183-203 |
It is suitable for the welding of ordinary circuit boards, such as: home appliances, electrical meters, automotive electrical appliances, hardware appliances, etc. |
|
Sn50-Pb50 |
183-216 |
|
|
Sn45-Pb55 |
183-217 |
|
|
Environmental protection solder paste series |
||
|
Sn99.7-Ag0.3-Cu0.7 |
217-227 |
Low cost, high melting point, can be used for welding with lower requirements |
|
Sn96.5-Ag3.0-Cu0.5 |
217 |
High cost, good performance, suitable for high-demand welding |
|
Sn64.7-Ag0.3-Bi35 |
178-182 |
Alloy with good properties, lower melting point, and finer crystal lattice |
|
Sn64-Ag1.0-Bi35 |
185-187 |
High cost, good performance, commonly used lead-free solder |
|
Sn42-Bi58 |
138 |
Prevent corrosion by CU, suitable for low temperature welding |
(1) The storage of solder paste should be controlled at 2-10℃. The service life of solder paste is six months (unopened).
(2) Solder paste should not be placed in a place exposed to sunlight. Temperature recovery
:
(3) The temperature of the solder paste must be returned to the ambient temperature of 25±5℃ before opening, and the heating time is about 3-4 hours, and it is forbidden to use other heaters to make the temperature rise rapidly.
Stirring:
(4) Stir fully after returning to temperature. The stirring time of using a blender is about 1-3 minutes, depending on the type of blender.
(5) When using the solder paste that has not been used up in the previous batch, remember to stir it first. If it is found to be dry and inconvenient to stir, you can add a small amount of special thinner for solder paste and then stir it.
Printing:
(6) Add about 3/2 of the solder paste to the steel plate, and try to keep no more than 1 tin of solder paste on the steel plate.
(7) Depending on the production speed, add the amount of solder paste on the steel plate in a small amount of multiple additions to maintain the quality of the solder paste.
(8) The unused solder paste cannot be placed together with the unused solder paste. It is recommended that the solder paste be used up within 24 hours after opening.
(9) After the solder paste is printed on the substrate, it is recommended to mount the components and enter the reflow soldering to complete the soldering within 4-6 hours.
(10) Please scrape the solder paste from the steel plate and put it in the solder paste can before changing the wire for more than 1 hour.
(11) In order to achieve the best welding effect, please control the indoor temperature at 22-28℃ and the temperature RH40-60%.
(12) When it is necessary to wipe the wrongly printed substrate, it is recommended to use ethanol or IPA to clean it.
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