Lead-free halogen-free soldering flux

Standards and scope of application

 

For the commercial quality lead-free soldering operation of electronic parts ASSGNBLY, this agent meets the following strict standards. It complies with the industrial standard ANSI/J-STD-004, Japanese industrial standard JIS-Z-3283-2001, German industrial standard DIN1707 and standard GB/T9491-2002, and all products have passed SGS testing.

 

advantage

 

Strong solderability, full solder joints, excellent tin penetration, especially for PCBs with dense solder joints, which can effectively reduce tin connection after wave soldering, and the solder joints are full and do not fade. High insulation resistance, good leveling, good leveling after soldering, quick-drying, non-sticky, can form a uniform resin protective film on the board, and form a non-reflective protective film on the solder joints. It will irritate the eyes due to light reflection, effectively reduce the vision of the eyes, and improve the quality of the operator's visual inspection. And the insulation resistance value is high, and can effectively reduce the double peaks caused by the tin pull

 

tip

 

Features

 

Smooth matting solder joints, full solder joints, good tin penetration.

 

High insulation resistance value.

 

Less smoke, no pollution to the environment, and no impact on human health.

 

Can pass strict copper mirror test.

 

The residue after soldering can form a protective film on the PCB board with uniform film formation, high insulation resistance and no moisture absorption.